The Limitations of the 200-Year-Old Physics Trinity
In the sub-3nm and Angstrom eras of semiconductor manufacturing, chip power densities exceed thousands of watts per square centimeter—comparable to the core of a nuclear reactor. In this extreme environment, the traditional three mechanisms hit a physical dead end:

The 1st Thermal Convection:
Traditional liquid cooling (single-phase water cooling) or air cooling relies on a fluid moving across a solid surface to carry sensible heat away. This requires massive surface areas and heavy flow rates. In the tightly packed 3D packaging environments of modern AI chips and ultra-slim smartphones, there is simply no physical space for macro-fluidic circulation, and it creates immense pressure drops. Isaac Newton discovered the foundational principles of convective heat transfer in 1701 with his publication of Newton's Law of Cooling.

The 2nd Thermal Conduction:
Subject to the thermal conductivity of solid materials. No matter how advanced the material is (graphene, diamond layers, 3D Vapor Chambers), the Thermal Interface Material (TIM/thermal paste) between the chip and the cooler creates an impassable "thermal resistance wall." The heat physically cannot escape the silicon fast enough. Fourier's Law is a fundamental law of heat conduction proposed by the French scientist Fourier in 1822.

The 3rd Thermal Radiation:
In the enclosed, microscopic cavities of a smartphone or an AI server chassis, radiative heat transfer is mathematically negligible. Josef Stefan (1879) and Ludwig Boltzmann (1884) determined that the total radiation emitted by an object is proportional to the fourth power of its absolute temperature (Stefan-Boltzmann Law).

The 4th Technique: Micro-Gap Phase-Change Rheological Cooling
Rheodevice bypassed the 200-year-old reliance on solid-to-solid interfaces. Instead of focusing on conducting heat through thicker solid blocks or pushing fluid via macro-convection, Rheodevice introduced a paradigm shift: Bringing the fluid into direct, microscopic contact with the heat source and precisely controlling its phase-change and rheological behavior at a micro-scale. US Patent US11,206,746 B1 (filed in 2020 with unamended/unrestricted claims, granted directly in Dec 2021) and Taiwan Invention Patent I676777 filed in 2018 stand as an absolute, un-bypassable prior-art fortress. 

RheoPad Keeps your MacBook and Nintendo Switch from Overheating

Device overheating remains to be one of the most critical issues in our modern electronic gadgets. Mobile device manufacturers (e.g. OEM, IDM) have been looking for ways to effectively remove the heat generated within the devices due to high-speed and resource-intensive computing using conventionally known approaches such as a) vapor chamber, b) heat pipe, c) heat sink, and d) high-thermally conductive materials (e.g. Graphene) that attempt to conduct the heat to the edge/surface of the device. However, the effectiveness of these approaches is limited since these devices eventually reach thermal saturation after ~20 minutes of intensive and exhaustive usage, resulting in device overheating. As the devices continue to operate under such mission-critical conditions, the surface temperature these devices can further reach above 40C (with internal temperature of the device >100 degC), giving rise to accelerated aging of the chips, electronic components, and battery in these devices. Worst yet, mishaps due to lithium-ion battery fires and explosions can happen.

RheoPad, based on our proprietary dual-mode/two-phase passive cooling technology, is designed to work seamlessly with mobile devices such as mobile phones, laptops, tablet PCs, game consoles, etc. Under passive direct liquid cooling (DLC) mode, the effectiveness of our RheoPad is further enhanced that can remove the heat within the devices more quickly and maintain a stable temperature at ~32C even when the devices are running apps that require high computational resources and power. The effective passive cooling technology provides unprecedented thermal dissipation performance while extending the battery life and endurance by >20%, compared to the other conventional approaches and existing solutions.