RheoPad (Ultra-Slim Passive Two-Phase Direct Liquid Cooling Pad)
Advanced Fluid Thermal Dissipation Pad
The advanced fluid thermal dissipation pad leverages our patented and proprietary cutting-edge nano-rheology and nano-thermodynamics technology to deliver efficient, reliable, maintenance-free cooling for modern electronics. Its innovative design enables high-performance thermal management without the need for bulky heatsinks, cooling fans, or plastic enclosures. (US Patent# 11,206,746 B1, Taiwan Patent# I676777 and M600522)
Patented/Proprietary Innovative Passive Direct Liquid Cooling (DLC)
At its core is an ultra-fine porous diatomite with a high-polymer suction layer that provides strong, reusable adhesion to many surfaces. This structure supports dual passive cooling modes for flexible, high-performance operation.
- Two-phase direct liquid cooling (DLC): Uses a working fluid such as water to absorb and dissipate heat through phase change for rapid, uniform temperature control.
- Air cooling: Boosts natural convection and surface heat transfer, ensuring stable operation even in fanless setups.
Key Features and Benefits
- Long-lasting durability: Built for extended life under demanding thermal cycles and environments.
- EMI-free and EMC compliant: Delivers cooling without electromagnetic interference, supporting sensitive electronics.
- No DC power consumption: Fully passive operation removes the need for external power and cuts energy use.
- Low-profile and lightweight: Ideal for compact devices, edge modules, and tight enclosures.
- No plastic housing required: Simplifies integration and supports material-efficient, sustainable designs.
- Fanless and metallic-free: Silent operation with no moving parts or bulky metal heatsinks, improving reliability and comfort.
This fluid thermal dissipation pad delivers next-generation passive cooling, combining advanced materials science with practical, ready-to-use performance for electronics, IoT devices, and high-density systems.
Use Cases and Applications
Advanced thermal management materials and solutions are highly promising for overheated device cooling, helping maintain stable performance, extend product lifespan, and enhance user safety. By efficiently dissipating heat, these solutions support compact, high‑power designs across a wide range of electronic devices and systems.
Consumer Electronics
Thermal solutions are ideal for everyday consumer electronics that generate significant heat during intensive use.
- Smart phone, tablet PC, and laptop cooling for gaming, streaming, and multitasking
- High‑density server and workstation thermal management in compute‑intensive environments
- Set‑top box, wireless router, game console, and Apple TV heat dissipation for stable connectivity and entertainment
- Other home appliances requiring reliable temperature control and long‑term durability
Portable Devices and Wearables
Compact, high‑performance portable devices demand efficient and lightweight cooling solutions.
- Power bank, power charger, and power adapter thermal control for safe, fast charging
- GoPro and action camera cooling for continuous 4K/8K recording
- Drone electronics and battery temperature management for stable flight
- AR/VR goggle heat dissipation for comfortable, immersive experiences
High-Performance Computing (HPC) and AI Infrastructures
Next‑generation communication networks require robust thermal management to support higher power densities and continuous operation.
- AI data centers and HPC edge computing nodes for cloud hyperscalers
- 5G and beyond‑5G base stations and small cells
- CPE (Customer Premises Equipment) for reliable high‑speed connectivity
- Cryptocurrency mining
These use cases demonstrate the versatility of modern thermal management technologies across consumer, industrial, and telecom applications, supporting higher performance, miniaturization, and long‑term reliability.
RheoPad
An Ultra-Slim Passive Dual-Mode/Two-Phase
Direct Liquid Cooling (DLC) Pad for Mobile Devices
RheoPad represents an advanced two-phase direct liquid cooling (DLC) solution that uses capillary action within a porous structure to manage high-density heat, often utilized in high-performance compute (HPC) electronics and AI servers.
Key Components and Mechanisms:
- Porous heat sink body: Serves as the primary structure, containing pores that absorb and hold a working fluid (liquid or gas).
- Pasting elements (Sheet-like Colloids): Polymer-based elements that fixedly attach the porous heat sink directly to the electronic device (e.g., CPU/GPU).
- Vaporization chamber (Gap): The thickness of the pasting element acts as a narrow gap or vapor chamber, where the liquid absorbs heat and turns into vapor.
Two-Phase Direct Liquid Cooling Mechanism: The liquid in the pores turns into vapor, absorbing a high amount of latent heat. This vaporized fluid then escapes or condenses, removing the heat from the heat sink. This method provides superior cooling efficiency, often outperforming single-phase air or liquid cooling with high compute performance while maintaining low thermal resistance for high-power workloads.
Production Descriptions:
- Proprietary dual-mode/two-phase passive direct liquid cooling (DLC) technology that prevents mobile devices from excessive overheating and further extends battery life (ENERGY SAVING) for MOBILE PHONES (Apple iPhone, Samsung, LG, Google, Huawei...), LAPTOPS (Apple Macbook, Microsoft, Dell, HP, ASUS, Acer, Lenovo...), TABLET PCs (iPad, Surface Pro, Dell, HP, ASUS, Acer...), GAME CONSOLES (Nintendo Switch, PS, Xbox), POWER BANKS/ADAPTERS/CHARGERS, DRONE, GoPRO, and AR/VR GOOGLE...
- Ultra-low profile, ultra-slim, portable, and lightweight with long-lasting durability. Major advantage over the USB-powered cooling fans.
- NO ENERGY and POWER CONSUMPTION (PURE PASSIVE). Fanless (noiseless) and metallic-free (no bulky heatsink). Major advantage over the USB-powered cooling fans.
- Patented/proprietary dual-mode/two-phase direct liquid cooling technology:1) Direct liquid cooling mode (highest performance, with working fluid such as water)2) Air cooling mode
- Product dimension: 71 x 47 x 3.5 (mm) or 2.8 x 1.85 x 0.14 (inch).Product weight: 19.5 (gram) or 0.69 (ounce).
Two-Phase Direct Liquid Cooling Technology
for AI Data Centers
Direct liquid cooling (DLC) is an advanced thermal management approach where coolant is brought in close contact with heat-generating components such as CPUs, GPUs, and accelerators. Instead of relying solely on air, liquid absorbs and transports heat far more efficiently, enabling precise temperature control even under sustained, intensive AI workloads. This is critical for training large models and running complex inference pipelines, where power density and heat output are significantly higher than in traditional IT environments.
By improving thermal efficiency, DLC reduces the need for energy-intensive air conditioning and allows higher rack densities without compromising reliability. Lower operating temperatures can extend hardware lifespan, reduce thermal throttling, and support more predictable performance at scale. In many deployments, direct liquid cooling also contributes to lower overall energy consumption and better Power Usage Effectiveness (PUE), supporting both cost optimization and sustainability goals. As AI data centers continue to grow in scale and complexity, direct liquid cooling is emerging as a modern, future-ready cooling solution for high-density computing environments.